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Red InGaP light-emitting diodes epitaxially grown on engineered Ge-on-Si substrates

机译:红色InGap发光二极管外延生长在工程Ge-on-si衬底上

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摘要

The integration of light emitting devices on silicon substrates has attracted intensive research for many years. In contrast to the InGaN light emitting diodes (LEDs) whose epitaxy technology on Si substrates is robust and mature, the epitaxy of other compound semiconductor light emitting materials covering the visible wavelength range on Si is still challenging. We have studied epitaxial growth of red InGaP light emitting materials on engineered Ge-on-Si substrates. Ge-on-Si was grown on 8'' Si substrates in a metal organic chemical vapour deposition (MOCVD) reactor using two- step growth and cycling annealing. Threading dislocation densities (TDDs) were controlled to as low as 10⁶ /cm² by using As-doped Ge initiation. A GaAs buffer layer and lattice-matched InGaP LEDs were grown on the Ge-on-Si sequentially in the same MOCVD process and red LEDs are demonstrated. InGaP multiple-quantum-well LED structures were grown on full 8″ Ge-on-Si substrates and characterized.
机译:多年来,发光器件在硅衬底上的集成吸引了广泛的研究。与Si衬底上的外延技术坚固且成熟的InGaN发光二极管(LED)相比,覆盖Si上可见波长范围的其他化合物半导体发光材料的外延仍然具有挑战性。我们已经研究了在工程化的Ge-on-Si衬底上红色InGaP发光材料的外延生长。 Ge-on-Si使用两步生长和循环退火在金属有机化学气相沉积(MOCVD)反应器中的8''Si衬底上生长。通过使用砷掺杂的锗引发,将线错位密度(TDDs)控制为低至10 6 / cm 2。在同一MOCVD工艺中,在Ge-on-Si上依次生长GaAs缓冲层和晶格匹配的InGaP LED,并演示了红色LED。 InGaP多量子阱LED结构在完整的8英寸Ge-on-Si衬底上生长并进行了表征。

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